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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6844 Issued Date : 1994.07.29 Revised Date : 2002.10.25 Page No. : 1/2
HMBT4125
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HMBT4125 is designed for general purpose switching and amplifier applications.
Absolute Maximum Ratings
SOT-23
* Maximum Temperatures Storage Temperature ............................................................................................ -65 ~ +150 C Junction Temperature .................................................................................................... +150 C * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 225 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ........................................................................................ -30 V VCEO Collector to Emitter Voltage ..................................................................................... -30 V VEBO Emitter to Base Voltage .......................................................................................... -4.0 V IC Collector Current....................................................................................................... -200 mA
Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. -30 -30 -4 50 25 200 Typ. Max. -50 -50 -0.4 -950 150 4.5 Unit V V V nA nA V mV Test Conditions IC=-10uA IC=-1mA IE=-10uA VCB=-20V VBE=-3V IC=-50mA, IB=-5mA IC=-50mA, IB=-5mA VCE=-1V, IC=-2mA VCE=-1V, IC=-50mA VCE=-20V, IC=-10mA, f=100MHz VCB=-5V, f=1MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
MHz pF
HMBT4125
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6844 Issued Date : 1994.07.29 Revised Date : 2002.10.25 Page No. : 2/2
A L
Marking:
3 BS 1 V G 2
ZD
Rank Code Control Code
3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N
C
D
H
K
J
Style: Pin 1.Base 2.Emitter 3.Collector *: Typical
DIM A B C D G H
Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040
Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10
DIM J K L S V
Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256
Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
* Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBT4125
HSMC Product Specification

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